Advanced packaging is becoming the next AI bottleneck.
TSMC’s CoWoS capacity is fully booked through 2026, capping supply just as AI compute demand continues to compound.
The imbalance between supply and demand forces diversification away from TSMC toward third-party packaging providers.
Below, we outline the key beneficiaries of the advanced-packaging surge, alongside opportunities in the defense sector.
Source: TrendForce
Key Report Insights:
CoWoS Sold Out: 2026 capacity capped → forced demand spillover
OSAT Rerating: AI volumes migrate to third-party packaging leaders
CapEx Signal: $7B U.S. packaging build locks multi-year demand
Tooling Torque: Packaging WFE mix doubles as volumes inflect
Memory Analog: Supply lag + price power mirror early HBM cycle
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